The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

May. 29, 2015
Applicant:

Nederlandse Organisatie Voor Toegepast-natuurwetenschappelijk Onderzoek Tno, s-Gravenhage, NL;

Inventors:

Sjoerd Oostrom, s-Gravenhage, NL;

Jacques Cor Johan Van Der Donck, s-Gravenhage, NL;

Olaf Kievit, s-Gravenhage, NL;

Nicole Ellen Papen-Botterhuis, s-Gravenhage, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); B08B 7/00 (2006.01); G03F 1/82 (2012.01); H01L 21/67 (2006.01); H01L 21/322 (2006.01); G03F 7/16 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0209 (2013.01); B08B 7/0028 (2013.01); G03F 1/82 (2013.01); H01L 21/02096 (2013.01); H01L 21/3221 (2013.01); H01L 21/67046 (2013.01); G03F 7/168 (2013.01);
Abstract

The invention is directed to a method for removing particulate contaminants from the backside of a wafer or reticle, and to a cleaning substrate for use in such method. In the method of the invention particulate contaminants are removed from the backside of a wafer or reticle with a cleaning substrate. The cleaning substrate comprises protrusions and a tacky layer between the protrusions. The method comprises contacting the backside of the wafer or reticle with the protrusions of the cleaning substrate while maintaining a distance between the wafer or reticle and the tacky layer, the distance being in the range of 1-10 μm.


Find Patent Forward Citations

Loading…