The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

May. 02, 2016
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Jui Hsieh Lai, Taoyuan, TW;

Ying-Hao Kuo, Hsin-Chu, TW;

Hai-Ching Chen, Hsin-Chu, TW;

Tien-I Bao, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); H01S 5/026 (2006.01); G02B 6/42 (2006.01); G02B 6/122 (2006.01); G02B 6/138 (2006.01); G02B 6/13 (2006.01); H01S 5/022 (2006.01); H01S 5/183 (2006.01);
U.S. Cl.
CPC ...
G02B 6/12004 (2013.01); G02B 6/12002 (2013.01); G02B 6/1221 (2013.01); G02B 6/13 (2013.01); G02B 6/138 (2013.01); G02B 6/42 (2013.01); G02B 6/4206 (2013.01); H01S 5/0262 (2013.01); H01S 5/02248 (2013.01); H01S 5/02256 (2013.01); H01S 5/02284 (2013.01); G02B 6/4246 (2013.01); G02B 2006/12102 (2013.01); G02B 2006/12121 (2013.01); G02B 2006/12123 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48464 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01); H01S 5/0228 (2013.01); H01S 5/02228 (2013.01); H01S 5/183 (2013.01);
Abstract

A semiconductor device, a package structure, and methods of forming the same are disclosed. An embodiment is a semiconductor device comprising a first optical device over a first substrate, a vertical waveguide on a top surface of the first optical device, and a second substrate over the vertical waveguide. The semiconductor device further comprises a lens capping layer on a top surface of the second substrate, wherein the lens capping layer is aligned with the vertical waveguide, and a second optical device over the lens capping layer.


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