The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2019
Filed:
Jun. 13, 2017
Applied Materials, Inc., Santa Clara, CA (US);
Eric Lau, Santa Clara, CA (US);
King Yi Heung, Union City, CA (US);
Charles C. Garretson, Sunnyvale, CA (US);
Jun Qian, Sunnyvale, CA (US);
Thomas H. Osterheld, Mountain View, CA (US);
Shuchivrat Datar, Santa Clara, CA (US);
David Chui, Saratoga, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A method for polishing dies locations on a substrate with a polishing module. A thickness at selected locations on the substrate is premeasured at a metrology station, each location corresponding to a location of a single die. The thickness obtained by the metrology station for the selected locations of the substrate is provided to a controller of a polishing module. The thickness corrections for each selected location on the substrate are determined. A polishing step in a polishing recipe is formed from the thickness correction for each selected location. A polishing parameter for each die location is calculated for the recipe.