The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Feb. 15, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Ruilong Xie, Niskayuna, NY (US);

Daniel Chanemougame, Niskayuna, NY (US);

Lars Liebmann, Mechanicville, NY (US);

Nigel Cave, Saratoga Springs, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 21/285 (2006.01); H01L 27/088 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823425 (2013.01); H01L 21/28518 (2013.01); H01L 21/823431 (2013.01); H01L 27/0886 (2013.01); H01L 29/785 (2013.01); H01L 2029/7858 (2013.01);
Abstract

A method of forming a logic or memory cell with less than or equal to 0 nm of TS extending past the active fins and the resulting device are provided. Embodiments include forming gates across pairs of fins on a substrate; forming pairs of RSD between the gates on the fins; forming a planar SAC cap on each of the gates; forming a metal layer over the substrate coplanar with the SACs; forming a TS structure in the metal layer over the fins, the TS structure formed over the pairs of RSD, each upper portion having a width equal to or less than an overall width of a pair of fins; forming spacers on opposite sides of the upper portions; removing the metal layer between adjacent spacers; forming an ILD over the substrate; and forming a CA on each upper portion and a CB on a gate through the ILD.


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