The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Apr. 02, 2018
Applicant:

Ultratech, Inc., San Jose, CA (US);

Inventors:

Ganesh Sundaram, Concord, MA (US);

Andrew M. Hawryluk, Los Altos, CA (US);

Daniel Stearns, Los Altos Hills, CA (US);

Assignee:

Ultratech, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/30 (2006.01); C23C 16/46 (2006.01); C23C 16/56 (2006.01); C30B 25/02 (2006.01); C30B 25/18 (2006.01); C30B 29/06 (2006.01); C30B 29/40 (2006.01); H01L 21/02 (2006.01); H01L 29/20 (2006.01); C23C 16/455 (2006.01); H01L 21/324 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0251 (2013.01); C23C 16/303 (2013.01); C23C 16/45527 (2013.01); C23C 16/45536 (2013.01); C23C 16/46 (2013.01); C23C 16/56 (2013.01); C30B 25/02 (2013.01); C30B 25/183 (2013.01); C30B 29/06 (2013.01); C30B 29/403 (2013.01); C30B 29/406 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02433 (2013.01); H01L 21/02458 (2013.01); H01L 21/02694 (2013.01); H01L 21/3245 (2013.01); H01L 29/2003 (2013.01);
Abstract

Atomic Layer Deposition (ALD) is used for heteroepitaxial film growth at reaction temperatures ranging from 80-400° C. The substrate and film materials are preferably matched to take advantage of Domain Matched Epitaxy (DME). A laser annealing system is used to thermally anneal deposition layer after deposition by ALD. In preferred embodiments, a silicon substrate is overlaid with an AlN nucleation layer and laser annealed. Thereafter a GaN device layer is applied over the AlN layer by an ALD process and then laser annealed. In a further example embodiment, a transition layer is applied between the GaN device layer and the AlN nucleation layer. The transition layer comprises one or more different transition material layers each comprising a AlGaN compound wherein the composition of the transition layer is continuously varied from AlN to GaN.


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