The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2019
Filed:
Oct. 11, 2017
Shibaura Mechatronics Corporation, Yokohama-shi, Kanagawa, JP;
Akihiko Ito, Yokohama, JP;
Yoshinao Kamo, Yokohama, JP;
Shigeki Matsunaka, Yokohama, JP;
Atsushi Fujita, Yokohama, JP;
SHIBAURA MECHATRONICS CORPORATION, Yokohama-Shi, Kanagawa, JP;
Abstract
An electronic component, an electronic component manufacturing apparatus, and an electronic component manufacturing method are provided which enable an electromagnetic wave shielding film formed on a package to achieve an excellent shielding characteristic. An electronic componentincludes an electromagnetic wave shielding filmformed on the top face of a package sealing elements. The thickness of the electromagnetic wave shielding filmon the top face of the packageis 0.5 to 9 μm, and the relationship between the average height Rc of the roughness curvature factor of the top face of the packageand the thickness Te of the electromagnetic wave shielding filmis Rc≤2Te.