The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Dec. 22, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Archanna Srinivasan, San Jose, CA (US);

Guang Chen, Fremont, CA (US);

Jun Pin Tan, Kepong, MY;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H03K 19/003 (2006.01); H03K 19/00 (2006.01); H03K 19/177 (2006.01); G11C 7/00 (2006.01);
U.S. Cl.
CPC ...
H03K 19/00346 (2013.01); H03K 19/0008 (2013.01); H03K 19/1776 (2013.01); G11C 7/00 (2013.01);
Abstract

An integrated circuit configured to execute multiple operations in parallel is provided. The integrated circuit may be organized into multiple logic sectors. Two or more groups of logic sectors may be executed in an interleaved fashion, where successive groups of logic sectors are activated after a predetermined amount of delay. The integrated circuit may include an array of memory cells. Rows of the memory cells may be accessed in an interleaving manner, where successive rows of memory cells are selected after a predetermined amount of delay. Operating groups of circuit components using an interleaving scheme can help improve operational efficiency while reducing power supply noise without having to increase die area for on-die decoupling capacitance.


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