The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

Apr. 26, 2017
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Harmeet Singh, Fremont, CA (US);

Keith Gaff, Fremont, CA (US);

Neil Benjamin, East Palo Alto, CA (US);

Keith Comendant, Fremont, CA (US);

Assignee:

LAM RESEARCH CORPORATION, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 1/02 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01J 37/32 (2006.01); C23C 4/10 (2016.01); C23C 4/134 (2016.01); C23C 14/50 (2006.01); C23C 14/54 (2006.01); C23C 14/34 (2006.01); C23C 14/10 (2006.01); C23C 16/40 (2006.01); C23C 16/458 (2006.01); C23C 16/46 (2006.01); C23C 16/509 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67103 (2013.01); C23C 4/10 (2013.01); C23C 4/134 (2016.01); C23C 14/10 (2013.01); C23C 14/34 (2013.01); C23C 14/50 (2013.01); C23C 14/541 (2013.01); C23C 16/401 (2013.01); C23C 16/4586 (2013.01); C23C 16/46 (2013.01); C23C 16/509 (2013.01); H01J 37/32082 (2013.01); H01J 37/32449 (2013.01); H01J 37/32724 (2013.01); H01L 21/6833 (2013.01); H01J 2237/334 (2013.01); H01J 2237/3321 (2013.01); H01J 2237/3323 (2013.01);
Abstract

A substrate support is provided, is configured to support a substrate in a plasma processing chamber, and includes first, second and third insulative layers, conduits and leads. The first insulative layer includes heater zones arranged in rows and columns. The second insulative layer includes conductive vias. First ends of the conductive vias are connected respectively to the heater zones. Second ends of the conductive vias are connected respectively to power supply lines. The third insulative layer includes power return lines. The conduits extend through the second insulative layer and into the third insulative layer. The leads extend through the conduits and connect to the heater zones. The heater zones are connected to the power return lines by the leads and are configured to heat corresponding portions of the substrate to provide a predetermined temperature profile across the substrate during processing of the substrate in the plasma processing chamber.


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