The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

Jul. 18, 2017
Applicant:

Imec Vzw, Leuven, BE;

Inventors:

Amey Mahadev Walke, Heverlee, BE;

Nadine Collaert, Blanden, BE;

Rita Rooyackers, Kessel-Lo, BE;

Assignee:

IMEC VZW, Leuven, BE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/778 (2006.01); H01L 21/762 (2006.01); H01L 21/18 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 23/535 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 29/04 (2006.01); H01L 21/84 (2006.01); H01L 29/78 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/187 (2013.01); H01L 21/02387 (2013.01); H01L 21/76251 (2013.01); H01L 21/76895 (2013.01); H01L 21/845 (2013.01); H01L 23/535 (2013.01); H01L 24/32 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 29/04 (2013.01); H01L 29/778 (2013.01); H01L 29/7851 (2013.01); H01L 23/66 (2013.01); H01L 2224/32501 (2013.01);
Abstract

A method for forming a semiconductor structure by bonding a donor substrate to a carrier substrate is disclosed herein. The donor substrate may include a plurality of semiconductor layers epitaxially grown on top of one another in, and optionally above, a trench of the donor substrate. The carrier substrate may include a first semiconductor device thereon. The method may include removing at least part of the donor substrate in such a way as to expose a semiconductor layer grown on the bottom of the trench, removing at least part of the exposed semiconductor layer, thereby modifying the plurality of semiconductor layers, and forming a second semiconductor device from the modified plurality of semiconductor layers.


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