The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2019
Filed:
Jun. 17, 2016
Applicant:
Ebara Corporation, Tokyo, JP;
Inventors:
Masayoshi Imai, Tokyo, JP;
Satomi Hamada, Tokyo, JP;
Assignee:
EBARA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F26B 5/12 (2006.01); H01L 21/67 (2006.01); F26B 21/14 (2006.01); H01L 21/677 (2006.01); F26B 5/16 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67034 (2013.01); F26B 5/12 (2013.01); F26B 5/16 (2013.01); F26B 21/14 (2013.01); H01L 21/67028 (2013.01); H01L 21/6776 (2013.01); F26B 2200/12 (2013.01);
Abstract
A wafer drying apparatus capable of preventing formation of a watermark is disclosed. The wafer drying apparatus includes: a conveying mechanism configured to convey a wafer in a drying chamber; an inert-gas jet nozzle disposed above the conveying mechanism and configured to form a descending jet of an inert gas; and a liquid suction nozzle disposed upstream of the inert-gas jet nozzle with respect to a conveying direction of the wafer. A distance between the liquid suction nozzle and a surface of the wafer when the wafer is being conveyed by the conveying mechanism is in a range of 1 mm to 2 mm.