The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2019

Filed:

Jun. 06, 2017
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Andreas Fischer, Castro Valley, CA (US);

Thorsten Lill, Santa Clara, CA (US);

Richard Janek, Oakland, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3213 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 21/225 (2006.01); H01L 21/326 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32136 (2013.01); H01L 21/0206 (2013.01); H01L 21/02068 (2013.01); H01L 21/225 (2013.01); H01L 21/31122 (2013.01); H01L 21/326 (2013.01); H01L 21/32138 (2013.01);
Abstract

A method for performing atomic layer etching (ALE) on a substrate is provided, including the following operations: performing a surface modification operation on a substrate surface, the surface modification operation configured to convert at least one monolayer of the substrate surface to a modified layer, wherein a bias voltage is applied during the surface modification operation, the bias voltage configured to control a depth of the substrate surface that is converted by the surface modification operation; performing a removal operation on the substrate surface, the removal operation configured to remove at least a portion of the modified layer from the substrate surface, wherein removing the portion of the modified layer is effected via a ligand exchange reaction that is configured to volatilize the portion of the modified layer. A plasma treatment can be performed to remove residues from the substrate surface following the removal operation.


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