The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Jan. 27, 2014
Applicant:

Hitachi High-technologies Corporation, Minato-ku, Tokyo, JP;

Inventors:

Hiroyuki Ushiba, Tokyo, JP;

Tsuyoshi Minakawa, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G01N 21/956 (2006.01); G01N 21/88 (2006.01); G01N 21/95 (2006.01); G06K 9/00 (2006.01); H01L 21/033 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G01N 21/8851 (2013.01); G01N 21/9501 (2013.01); G01N 21/956 (2013.01); G01N 21/95607 (2013.01); G06K 9/00 (2013.01); G01N 2021/8887 (2013.01); G06T 2207/30148 (2013.01); H01L 21/0337 (2013.01); H01L 22/12 (2013.01);
Abstract

A pattern evaluation device of the present invention includes a model estimation unit that estimates a model caused by a manufacturing method on the basis of an inspection image, a deformation amount estimation unit that estimates a deformation amount of the inspection image by using the estimated model, a reference data deformation unit that deforms reference data by using the estimated deformation amount, and an evaluation unit that performs an evaluation process by comparing the reference data which is deformed by the reference data deformation unit with the inspection image.


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