The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
Jul. 10, 2017
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Tzu-Hung Lin, Hsinchu County, TW;
I-Hsuan Peng, Hsinchu, TW;
Nai-Wei Liu, Kaohsiung, TW;
Wei-Che Huang, Hsinchu County, TW;
Assignee:
MEDIATEK INC., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/06 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/24 (2013.01); H01L 29/0657 (2013.01); H01L 24/13 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/94 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18162 (2013.01);
Abstract
A semiconductor chip package includes a first die and a second die. The first die and second die are coplanar and disposed in proximity to each other in a side-by-side fashion. A non-straight line shaped interface gap is disposed between the first die and second die. A molding compound surrounds the first die and second die. A redistribution layer (RDL) structure is disposed on the first die, the second die and on the molding compound. The first semiconductor die is electrically connected to the second semiconductor die through the RDL structure.