The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Jan. 26, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Sandeep K. Venishetti, Folsom, CA (US);

Sanjeev S. Jahagirdar, Folsom, CA (US);

Srinivas Thota, El Dorado Hills, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/26 (2006.01); G06F 1/18 (2006.01); G06F 1/3287 (2019.01); H02J 3/00 (2006.01);
U.S. Cl.
CPC ...
G06F 1/26 (2013.01); G06F 1/189 (2013.01); G06F 1/263 (2013.01); G06F 1/3287 (2013.01); H02J 2003/001 (2013.01); Y02D 10/171 (2018.01); Y10T 307/352 (2015.04);
Abstract

An apparatus includes a distribution network that includes circuitry configured to receive first power from a first voltage source and second power from a second voltage source, and to deliver power to each of a plurality of electronic circuitry blocks (ECBs), including to deliver first ECB power to a first ECB and second ECB power to a second ECB. The first ECB power includes a first portion of the first power and a first portion of the second power. The apparatus also includes power management logic to dynamically adjust the power to be provided to each ECB. Responsive to a change in a first activity level of the first ECB, the power management logic is to change the first ECB power by adjustment of the first portion of the first power and adjustment of the first portion of the second power. Other embodiments are described and claimed.


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