The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2019
Filed:
Mar. 29, 2017
Applicant:
General Electric Company, Schenectady, NY (US);
Inventors:
Arun Virupaksha Gowda, Rexford, NY (US);
Paul Alan McConnelee, Albany, NY (US);
Assignee:
General Electric Company, Schenectady, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 21/78 (2006.01); H01L 25/00 (2006.01); H01L 21/768 (2006.01); H01L 21/683 (2006.01); H01L 23/528 (2006.01); H01L 25/07 (2006.01); H01L 23/31 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 24/46 (2013.01); H01L 21/6835 (2013.01); H01L 21/76879 (2013.01); H01L 21/78 (2013.01); H01L 23/3164 (2013.01); H01L 23/525 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/24 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/82 (2013.01); H01L 24/85 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H01L 23/564 (2013.01); H01L 24/29 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/03466 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05018 (2013.01); H01L 2224/05093 (2013.01); H01L 2224/05094 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/4847 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48847 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/4911 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8203 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83447 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1302 (2013.01); H01L 2924/1304 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13023 (2013.01); H01L 2924/13034 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract
A power overlay (POL) structure includes a power device having at least one upper contact pad disposed on an upper surface of the power device, and a POL interconnect layer having a dielectric layer coupled to the upper surface of the power device and a metallization layer having metal interconnects extending through vias formed through the dielectric layer and electrically coupled to the at least one upper contact pad of the power device. The POL structure also includes at least one copper wirebond directly coupled to the metallization layer.