The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2019
Filed:
Feb. 03, 2017
Applicant:
Via Alliance Semiconductor Co., Ltd., Shanghai, CN;
Inventors:
Yeh-Chi Hsu, New Taipei, TW;
Chen-Yueh Kung, New Taipei, TW;
Assignee:
VIA ALLIANCE SEMICONDUCTOR CO., LTD., Shanghai, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 23/498 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/13 (2013.01); H01L 23/145 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 24/00 (2013.01); H01L 2224/1308 (2013.01); H01L 2224/81 (2013.01);
Abstract
A circuit substrate for a chip bonding thereon includes a core substrate having a chip-side surface and a bump-side surface opposite to the chip-side surface, a first through via plug passing through the core substrate, a pad disposed on the bump-side surface, in contact with the first through via plug, and a first thickness enhancing conductive pattern disposed on a surface of the pad, which is away from the bump-side surface.