The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2019

Filed:

Sep. 07, 2016
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Arpit Jain, Indore, IN;

Arpit Yati, Lucknow, IN;

Thirupurasundari Jayaraman, Chennai, IN;

Raghavan Konuru, Kurnnol, IN;

Raj Kuppa, Santa Clara, CA (US);

Hema Prasad, Chennai, IN;

Saiyashwanth Momula, Telangana, IN;

Arun Lobo, Karnataka, IN;

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 7/18 (2006.01); G06T 7/00 (2017.01); H01J 37/22 (2006.01); G01N 23/2251 (2018.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0044 (2013.01); G01N 23/2251 (2013.01); G06T 7/001 (2013.01); H01J 37/222 (2013.01); H01L 22/20 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/30148 (2013.01);
Abstract

Deskew for image review, such as SEM review, aligns inspection and review coordinate systems. Deskew can be automated using design files or inspection images. A controller that communicates with a review tool can align a file of the wafer, such as a design file or an inspection image, to an image of the wafer from the review tool; compare alignment sites of the file to alignment sites of the image from the review tool; and generate a deskew transform of coordinates of the alignment sites of the file and coordinates of alignment sites of the image from the review tool. The image of the wafer may not contain defects.


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