The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2019
Filed:
Aug. 05, 2013
Applicant:
Hitachi Chemical Company, Ltd., Chiyoda-ku, Tokyo, JP;
Inventors:
Dai Ishikawa, Tsukuba, JP;
Hiroshi Matsumoto, Tsukuba, JP;
Michiko Natori, Tsukuba, JP;
Hideo Nakako, Tsukuba, JP;
Toshiaki Tanaka, Tsukuba, JP;
Assignee:
HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/30 (2006.01); B23K 35/02 (2006.01); B23K 35/362 (2006.01); C22C 5/06 (2006.01); H01L 23/00 (2006.01); H01B 1/22 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
B23K 35/3006 (2013.01); B23K 35/025 (2013.01); B23K 35/362 (2013.01); C22C 5/06 (2013.01); H01B 1/22 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 24/27 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32221 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01); H01L 2924/203 (2013.01); H01L 2924/2064 (2013.01);
Abstract
A silver paste composition comprising silver particles having a particle diameter of 0.1 μm to 20 μm, and a solvent, wherein the above-described solvent comprises a solvent having a boiling point of 300° C. or more.