The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

May. 26, 2016
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Wanbing Yi, Singapore, SG;

Yi Jiang, Singapore, SG;

Daxiang Wang, Singapore, SG;

Wei Shao, Singapore, SG;

Juan Boon Tan, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 43/12 (2006.01); H01L 27/22 (2006.01);
U.S. Cl.
CPC ...
H01L 43/12 (2013.01); H01L 27/228 (2013.01);
Abstract

Device and methods of forming a device are disclosed. The method includes providing a substrate defined with at least first and second regions. A first dielectric layer is provided over the first and second regions of the substrate. The first dielectric layer corresponds to pre-metal dielectric (PMD) or CA level which comprises a plurality of contact plugs in the first and second regions. A first interlevel dielectric (ILD) layer is provided over the first dielectric layer. The first ILD layer accommodates a plurality of metal lines in M1 metal level in the first and second regions and via contact in V0 via level in the first region. A magnetic random access memory (MRAM) cell is formed in the second region. The MRAM cell includes a magnetic tunnel junction (MTJ) element sandwiched between the M1 metal level and CA level.


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