The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Dec. 05, 2017
Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventors:

Kazuhiro Fujita, Kyoto, JP;

Atsuyasu Miura, Kyoto, JP;

Hiroki Tsujikawa, Kyoto, JP;

Yuya Tsuchihashi, Kyoto, JP;

Akihiko Taki, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B08B 3/10 (2006.01); H01L 21/306 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6708 (2013.01); B08B 3/10 (2013.01); H01L 21/02041 (2013.01); H01L 21/30604 (2013.01); H01L 21/67023 (2013.01); H01L 21/67028 (2013.01); H01L 21/67075 (2013.01); H01L 21/67109 (2013.01);
Abstract

A substrate processing method is a substrate processing method which applies sequentially common etching processing which is common to each of a plurality of substrates. The common etching processing has an etching step and a high-temperature liquid discharge step. The substrate processing method further includes a piping heating step in which, of the plurality of common etching processings applied to the plurality of substrates, before the initial common etching processing, the pipe wall of the common piping is raised in temperature up to a predetermined second liquid temperature higher than a first liquid temperature and in each of the common etching processings, after each of high-temperature liquid discharge steps and before each of next etching steps, there is not performed a step in which the pipe wall of the common piping is lowered in temperature.


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