The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2019
Filed:
Jan. 18, 2018
Lam Research Corporation, Fremont, CA (US);
Hui-Jung Wu, Pleasanton, CA (US);
Thomas Joseph Knisley, Beaverton, OR (US);
Nagraj Shankar, Tualatin, OR (US);
Meihua Shen, Fremont, CA (US);
John Hoang, Fremont, CA (US);
Prithu Sharma, Santa Clara, CA (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
Methods and techniques for fabricating metal interconnects, lines, or vias by subtractive etching and liner deposition methods are provided. Methods involve depositing a blanket copper layer, removing regions of the blanket copper layer to form a pattern, treating the patterned metal, depositing a copper-dielectric interface material such that the copper-dielectric interface material adheres only to the patterned copper, depositing a dielectric barrier layer on the substrate, and depositing a dielectric bulk layer on the substrate.