The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Aug. 23, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Abhishek Dube, Fremont, CA (US);

Schubert S. Chu, San Francisco, CA (US);

Jessica S. Kachian, Sunnyvale, CA (US);

David Thompson, San Jose, CA (US);

Jeffrey Anthis, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01J 37/32 (2006.01); C23C 16/04 (2006.01); H01L 21/283 (2006.01); C23C 16/455 (2006.01); C23C 16/52 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0228 (2013.01); C23C 16/04 (2013.01); C23C 16/45544 (2013.01); C23C 16/52 (2013.01); H01J 37/32009 (2013.01); H01J 37/32357 (2013.01); H01J 37/32522 (2013.01); H01J 37/32899 (2013.01); H01L 21/02049 (2013.01); H01L 21/02172 (2013.01); H01L 21/283 (2013.01); H01J 2237/334 (2013.01);
Abstract

Methods and apparatus for processing a substrate are described herein. Methods for passivating dielectric materials include forming alkyl silyl moieties on exposed surfaces of the dielectric materials. Suitable precursors for forming the alkyl silyl moieties include (trimethylsilyl)pyrrolidine, aminosilanes, and dichlorodimethylsilane, among others. A capping layer may be selectively deposited on source/drain materials after passivation of the dielectric materials. Apparatus for performing the methods described herein include a platform comprising a transfer chamber, a pre-clean chamber, an epitaxial deposition chamber, a passivation chamber, and an atomic layer deposition chamber.


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