logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10197914 B1

PDFFull Text
Date of Patent:
Feb. 05, 2019

Filed:

Feb. 14, 2017

Positive photosensitive resin composition, photo-curable dry film and method for producing the same, patterning process, and laminate

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Katsuya Takemura, Jyoetsu, JP;

Masashi Iio, Jyoetsu, JP;

Hiroyuki Urano, Jyoetsu, JP;

Takashi Miyazaki, Jyoetsu, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Amanda C Walke

Int. Cl.
CPC ...
G03F 7/075 (2006.01); G03F 7/039 (2006.01); H01L 21/027 (2006.01); C08L 83/14 (2006.01); C08G 77/12 (2006.01); C07C 39/21 (2006.01); C08G 77/52 (2006.01); G03F 7/20 (2006.01); C09D 183/14 (2006.01); H01L 21/311 (2006.01); C08G 77/04 (2006.01); C08G 77/06 (2006.01); G03F 7/004 (2006.01); G03F 7/11 (2006.01); G03F 7/16 (2006.01); G03F 7/32 (2006.01); G03F 7/38 (2006.01); G03F 7/40 (2006.01);
U.S. Cl.
CPC ...
G03F 7/039 (2013.01); C07C 39/21 (2013.01); C08G 77/04 (2013.01); C08G 77/06 (2013.01); C08G 77/12 (2013.01); C08G 77/52 (2013.01); C08L 83/14 (2013.01); C09D 183/14 (2013.01); G03F 7/0045 (2013.01); G03F 7/0757 (2013.01); G03F 7/11 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/2002 (2013.01); G03F 7/2037 (2013.01); G03F 7/322 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01); H01L 21/0271 (2013.01); H01L 21/311 (2013.01);
Abstract

The present invention provides a positive photosensitive resin composition containing (A) a polymer compound containing a siloxane chain, the polymer compound having a repeating unit shown by the general formula (1) and a weight average molecular weight of 3,000 to 500,000, (B) a photosensitive material capable of generating an acid by light and increasing a dissolution rate in an aqueous alkaline solution, (C) a crosslinking agent, and (D) a solvent. There can be provided a positive photosensitive resin composition that can remedy the problem of delamination caused on a metal wiring such as Cu and Al, an electrode, and a substrate, especially on a substrate such as SiN, and can form a fine pattern having a forward tapered shape without generating a scum and a footing profile in the pattern bottom and on the substrate when a widely used 2.38% TMAH aqueous solution is used as the developer.

Find Patent Forward Citations

Loading…