The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 22, 2019

Filed:

Nov. 10, 2016
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Cheng-Yu Ho, Kaohsiung, TW;

Chen-Chao Wang, Kaohsiung, TW;

Chun-Yen Ting, Kaohsiung, TW;

Ming-Fong Jhong, Kaohsiung, TW;

Po-Chih Pan, Kaohsiung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01Q 9/04 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2006.01); H01Q 13/10 (2006.01); H01Q 19/30 (2006.01); H01Q 21/28 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/045 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 25/0657 (2013.01); H01Q 9/0457 (2013.01); H01Q 13/10 (2013.01); H01Q 19/30 (2013.01); H01Q 21/28 (2013.01); H01L 24/17 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/3025 (2013.01);
Abstract

Various embodiments of the present disclosure relate to a semiconductor device package including a carrier, an electrical component, an antenna, a conductive pad and a conductive line. The carrier includes a top surface. The electrical component is disposed over the top surface of the carrier. The antenna is disposed over the top surface of the carrier and spaced away from the electrical component. The conductive pad is disposed over the top surface of the carrier and beneath the antenna, wherein the conductive pad includes a resonant structure. The conductive line is electrically connected to the electrical component and extends within the carrier. A part of the conductive line is beneath the antenna and the resonant structure of the conductive pad.


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