The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2019
Filed:
Nov. 18, 2016
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventors:
Cheng-Tai Hsiao, Tainan, TW;
Hsun-Chung Kuang, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 21/7684 (2013.01); H01L 21/76802 (2013.01); H01L 21/76822 (2013.01); H01L 21/76843 (2013.01); H01L 21/76856 (2013.01); H01L 21/76879 (2013.01); H01L 23/5226 (2013.01); H01L 23/53266 (2013.01);
Abstract
A through via structure includes a conductive wiring, at least one dielectric layer over the conductive wiring, a via hole in the at least one dielectric layer and exposing the conductive wiring, and a conductive via in the via hole. The conductive via includes a conductive barrier layer in a bottom portion of the via hole, and a conductive layer in a top portion of the via hole.