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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10177357 B1

PDFFull Text
Date of Patent:
Jan. 08, 2019

Filed:

Sep. 07, 2015

Method for producing porous polyimide film

Applicant:

Tokyo Ohka Kogyo Co., Ltd., Kanagawa, JP;

Inventors:

Mitsuharu Tobari, Kanagawa, JP;

Yoshitsugu Kawamura, Kanagawa, JP;

Kaoru Ishikawa, Kanagawa, JP;

Tsukasa Sugawara, Kanagawa, JP;

Assignee:

TOKYO OHKA KOGYO CO., LTD., Kanagawa, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Kara B Boyle

Int. Cl.
CPC ...
B01D 67/00 (2006.01); B01D 71/64 (2006.01); H01M 2/14 (2006.01); C08G 73/10 (2006.01); H01M 2/16 (2006.01); B01D 69/02 (2006.01); B01D 69/12 (2006.01); B32B 27/28 (2006.01); B32B 27/34 (2006.01); H01M 10/05 (2010.01); H01M 8/103 (2016.01);
U.S. Cl.
CPC ...
H01M 2/145 (2013.01); B01D 67/003 (2013.01); B01D 67/0006 (2013.01); B01D 67/0009 (2013.01); B01D 67/0023 (2013.01); B01D 69/02 (2013.01); B01D 69/12 (2013.01); B01D 71/64 (2013.01); B32B 27/28 (2013.01); B32B 27/34 (2013.01); C08G 73/10 (2013.01); H01M 2/16 (2013.01); H01M 2/1653 (2013.01); H01M 8/103 (2013.01); H01M 10/05 (2013.01); B01D 2323/12 (2013.01); B01D 2325/021 (2013.01); B32B 2307/20 (2013.01); B32B 2457/10 (2013.01);
Abstract

Provided is a method for producing a porous polyimide film with which it is possible to suppress the occurrence of curling in the polyimide-fine particle composite film obtained by firing the unfired composite film. The method for producing a porous polyimide film of the present invention includes, in the following order: forming an unfired composite film using a varnish that contains a resin including polyamide acid and/or polyimide, fine particles, and a solvent; immersing the unfired composite film in a solvent including water; firing the unfired composite film to obtain a polyimide-fine particle composite film; and removing the fine particles from the polyimide-fine particle composite film.

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