logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10177063 B1

PDFFull Text
Date of Patent:
Jan. 08, 2019

Filed:

Feb. 07, 2017

Element chip and method for manufacturing the same

Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Bunzi Mizuno, Nara, JP;

Mitsuru Hiroshima, Osaka, JP;

Shogo Okita, Hyogo, JP;

Noriyuki Matsubara, Osaka, JP;

Atsushi Harikai, Osaka, JP;

Assignee:

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Evren Seven

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/268 (2006.01); H01L 21/311 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/544 (2006.01); H01L 21/683 (2006.01); H01L 21/02 (2006.01); H01L 21/033 (2006.01); H01L 21/3065 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3192 (2013.01); H01L 21/0212 (2013.01); H01L 21/02274 (2013.01); H01L 21/0337 (2013.01); H01L 21/268 (2013.01); H01L 21/3065 (2013.01); H01L 21/30655 (2013.01); H01L 21/311 (2013.01); H01L 21/31116 (2013.01); H01L 21/31138 (2013.01); H01L 21/56 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 23/3185 (2013.01); H01L 23/544 (2013.01); H01L 23/562 (2013.01); H01L 21/67109 (2013.01); H01L 21/6831 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01);
Abstract

A method for manufacturing an element chip includes a protection film stacking step of staking a protection film to the element region, and the dividing region, the part of the exposed second damaged region and a protection film etching step of removing a part of the protection film which is stacked on the dividing region and the protection film which is stacked on the element region by exposing the substrate to second plasma and remaining the protection film for covering the part of the second damaged region. Furthermore, the method for manufacturing an element chip includes a plasma dicing step of dividing the substrate to a plurality of element chips by exposing the substrate to third plasma in a state where the second main surface is supported by a supporting member.

Find Patent Forward Citations

Loading…