The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Jun. 14, 2013
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Hideo Nakako, Tsukuba, JP;
Toshiaki Tanaka, Tsukuba, JP;
Michiko Natori, Tsukuba, JP;
Dai Ishikawa, Tsukuba, JP;
Hiroshi Matsumoto, Tsukuba, JP;
Assignee:
HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 11/04 (2006.01); H01L 23/495 (2006.01); C09J 1/00 (2006.01); H01L 23/00 (2006.01); C08K 3/08 (2006.01); C09J 9/02 (2006.01); H01B 1/22 (2006.01); C08K 7/00 (2006.01);
U.S. Cl.
CPC ...
C09J 11/04 (2013.01); C08K 3/08 (2013.01); C09J 1/00 (2013.01); C09J 9/02 (2013.01); H01B 1/22 (2013.01); H01L 23/49579 (2013.01); H01L 24/29 (2013.01); C08K 7/00 (2013.01); C08K 2003/0806 (2013.01); C08K 2003/0893 (2013.01); C08K 2201/001 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29318 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/181 (2013.01);
Abstract
An adhesive composition comprising silver particles containing silver atoms and zinc particles containing metallic zinc, wherein the silver atom content is 90 mass % or greater and the zinc atom content is from 0.01 mass % to 0.6 mass %, with respect to the total transition metal atoms in the solid portion of the adhesive composition.