The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Jun. 29, 2017
Applicant:

Alpha and Omega Semiconductor (Cayman) Ltd., Grand Cayman, KY;

Inventors:

Hongyong Xue, Portland, OR (US);

Lei Zhang, Portland, OR (US);

Brian Schorr, Beaverton, OR (US);

Chris Wiebe, Hillsboro, OR (US);

Wenjun Li, Portland, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/10 (2006.01); H01L 29/739 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1095 (2013.01); H01L 29/66333 (2013.01); H01L 29/66348 (2013.01); H01L 29/7395 (2013.01); H01L 29/7397 (2013.01);
Abstract

An RC-IGBT includes a semiconductor body formed having a base region incorporating a field stop zone where the base region and the field stop zone are both formed using an epitaxial process and the field stop zone has an enhanced doping profile to realize improved soft-switching performance for the semiconductor device. In alternate embodiments, RC-IGBT device, including the epitaxial layer field stop zone, are realized through a fabrication process that uses front side processing only to form the backside contact regions and the front side device region. The fabrication method forms an RC-IGBT device using front side processing to form the backside contact regions and then using wafer bonding process to flip the semiconductor structure onto a carrier wafer so that front side processing is used again to form the device region.


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