The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2019
Filed:
Dec. 23, 2013
Sanka Ganesan, Chandler, AZ (US);
John S. Guzek, Chandler, AZ (US);
Nitesh Nimkar, Chandler, AZ (US);
Klaus Reingruber, Langquaid, DE;
Thorsten Meyer, Regensburg, DE;
Sanka Ganesan, Chandler, AZ (US);
John S. Guzek, Chandler, AZ (US);
Nitesh Nimkar, Chandler, AZ (US);
Klaus Reingruber, Langquaid, DE;
Thorsten Meyer, Regensburg, DE;
INTEL CORPORATION, Santa Clara, CA (US);
Abstract
Embodiments of the present disclosure are directed to package assemblies and methods for fabricating package assemblies. In one embodiment, a package assembly includes a die at least partially embedded in a mold compound; and a through mold via (TMV). The TMV may have vertical sides or may include two different portions with varying shapes. In some instances, prefabricated via bars may be used during fabrication. Package assemblies of the present disclosure may include package-on-package (POP) interconnects having a pitch of less than 0.3 mm. Other embodiments may be described and/or claimed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile