The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Nov. 07, 2017
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Hsiao-Lin Hsu, Yunlin County, TW;

En-Chiuan Liou, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 29/78 (2006.01); H01L 27/088 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823431 (2013.01); H01L 21/823437 (2013.01); H01L 21/823481 (2013.01); H01L 27/0886 (2013.01); H01L 29/785 (2013.01); H01L 29/7855 (2013.01); H01L 29/7856 (2013.01); H01L 29/401 (2013.01); H01L 29/66545 (2013.01);
Abstract

A semiconductor device includes a substrate having a fin structure extending along a first direction. The fin structure protrudes from a top surface of a trench isolation region and has a first height. A plurality of gate lines including a first gate line and a second gate line extend along a second direction and striding across the fin structure. The first gate line has a discontinuity directly above a gate cut region. The second gate line is disposed in proximity to a dummy fin region, and does not overlap with the dummy fin region. The fin structure has a second height within the dummy fin region, and the second height is smaller than the first height.


Find Patent Forward Citations

Loading…