The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Jun. 30, 2017
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Yu-Chen Wei, New Taipei, TW;

Chun-Jui Chu, Taoyuan, TW;

Chun-Chieh Chan, Hsinchu, TW;

Jen-Chieh Lai, Tainan, TW;

Shih-Ho Lin, Jhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B08B 1/04 (2006.01); B24B 37/08 (2012.01); B24B 37/04 (2012.01); H01L 21/321 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67046 (2013.01); B08B 1/04 (2013.01); B24B 37/044 (2013.01); B24B 37/08 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01); H01L 21/67051 (2013.01);
Abstract

Apparatuses and methods for performing a post-CMP cleaning are provided. The apparatus includes a chamber configured to receive a wafer in need of having CMP residue removed. The apparatus also includes a spray unit configured to apply a first cleaning solution to at least one surface of the wafer. The apparatus further includes a brush cleaner configured to scrub the at least one surface of the wafer. In addition, the apparatus includes at least one inner tank disposed in the chamber for storing a second cleaning solution that is used to clean the brush cleaner.


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