The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Dec. 10, 2014
Applicant:

Hitachi High-technologies Corporation, Minato-ku, Tokyo, JP;

Inventors:

Takehiro Hirai, Tokyo, JP;

Hideki Nakayama, Tokyo, JP;

Kenichi Nishigata, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/26 (2006.01); H01J 37/28 (2006.01); G01N 5/00 (2006.01); G01N 21/956 (2006.01); G01N 21/95 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G01N 21/956 (2013.01); G01N 21/9501 (2013.01); H01J 37/28 (2013.01); H01L 22/12 (2013.01); G01N 2223/6116 (2013.01);
Abstract

In a scheme for analyzing low magnification defect images and determining whether or not a defect detection method using cell comparison is applicable, if a defect detection method using cell comparison cannot be applied and the proportion transitioning to a defect detection method using die comparison increases, throughput may decrease even more than starting out with defect detection by a defect detection method using die comparison. The purpose of present invention is to carry out high precision defect detection with a stable throughput. In the present invention, the defect detection processing mode applied for detecting defects from the defect image is determined using a reference image, and defects are detected from the defect image by the defect detection processing mode that has been determined.


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