The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Oct. 13, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Fee Li Lie, Albany, NY (US);

Siva Kanakasabapathy, Pleasanton, CA (US);

Eric Miller, Watervliet, NY (US);

Hyung Joo Shin, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/00 (2006.01); C23C 16/52 (2006.01); H01L 21/67 (2006.01); C23C 16/455 (2006.01);
U.S. Cl.
CPC ...
C23C 16/52 (2013.01); C23C 16/45534 (2013.01); C23C 16/45544 (2013.01); C23C 16/45553 (2013.01); C23C 16/45561 (2013.01); H01L 21/67069 (2013.01); H01L 21/67253 (2013.01); H01L 21/67167 (2013.01);
Abstract

An approach to optimizing the throughput in an atomic layer deposition process. The approach charges a first wafer chamber with a first gas from a first storage tank for a first cycle run and determines whether the first cycle run has completed. The approach transfers the first gas from the first wafer chamber to a second wafer chamber and charges the first wafer chamber with a second gas from a second storage tank for a second cycle run and determines whether the second cycle run has completed. The approach transfers the first gas from the second wafer chamber to the first storage tank and transfers the second gas from the first wafer chamber to the second wafer chamber for a third cycle run. The approach determines whether the third cycle run has completed and transfers the second gas from the second wafer chamber to the second storage tank.


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