The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Nov. 02, 2016
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Tamami Takahashi, Tokyo, JP;

Masaya Seki, Tokyo, JP;

Hiroaki Kusa, Tokyo, JP;

Kenji Yamaguchi, Tokyo, JP;

Masayuki Nakanishi, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 21/00 (2006.01); B24B 49/00 (2012.01); B24B 27/00 (2006.01); B24B 41/06 (2012.01); B24B 9/06 (2006.01); B24B 21/20 (2006.01); B24B 37/04 (2012.01); B24B 37/30 (2012.01);
U.S. Cl.
CPC ...
B24B 21/002 (2013.01); B24B 9/065 (2013.01); B24B 21/004 (2013.01); B24B 21/008 (2013.01); B24B 21/20 (2013.01); B24B 27/0076 (2013.01); B24B 37/042 (2013.01); B24B 37/30 (2013.01); B24B 41/068 (2013.01); B24B 49/00 (2013.01); Y10T 428/24777 (2015.01);
Abstract

A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.


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