The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Oct. 03, 2016
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Chih-Teng Liao, Hsin-Chu, TW;
Tzu-Chan Weng, Kaohsiung, TW;
Yi-Wei Chiu, Kaohsiung, TW;
Chen Yung-Chan, Tainan, TW;
Chia-Tsung Tso, Hsin-Chu, TW;
Yu-Li Lin, Kaohsiung, TW;
Chun-Hung Liu, New Taipei, TW;
Kun-Cheng Chen, Kaohsiung, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A semiconductor manufacturing tool and process to form semiconductor devices is provided. An edge ring of the semiconductor manufacturing tool comprises a high electron mobility material in order to extend an electrical field and sheath such that curvature from the sheath is moved away from a semiconductor wafer so that an impact from the curvature is reduced or eliminated during an etching process.