The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2018

Filed:

Mar. 13, 2017
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chung-Ming Wang, Hsinchu, TW;

Fang-Ting Kuo, Hsinchu County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 29/423 (2006.01); H01L 29/06 (2006.01); H01L 29/78 (2006.01); H01L 21/28 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/4232 (2013.01); H01L 21/28017 (2013.01); H01L 21/76224 (2013.01); H01L 29/0649 (2013.01); H01L 29/66477 (2013.01); H01L 29/78 (2013.01);
Abstract

A semiconductor device is provided, which includes a substrate, a shallow trench isolation (STI), a gate dielectric structure, a capping structure and a gate structure. The STI is in the substrate and defines an active area of the substrate. The gate dielectric structure is on the active area. The capping structure is adjacent to the gate dielectric structure and at edges of the active area. The gate structure is on the gate dielectric structure and the capping structure. An equivalent oxide thickness of the capping structure is substantially greater than an equivalent oxide thickness of the gate dielectric structure.


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