The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2018

Filed:

Mar. 24, 2017
Applicant:

Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;

Inventors:

Sheng-Hsiung Chen, Hsinchu County, TW;

Chung-Hsing Wang, Hsinchu County, TW;

Fong-yuan Chang, Hsinchu County, TW;

Lee-Chung Lu, Taipei, TW;

Li-Chun Tien, Tainan, TW;

Po-Hsiang Huang, Tainan, TW;

Shao-huan Wang, Taichung, TW;

Ting Yu Chen, Hsinchu, TW;

Yen-Pin Chen, Taipei, TW;

Chun-Chen Chen, Hsinchu County, TW;

Tzu-Hen Lin, Hsinchu, TW;

Tai-Yu Cheng, Pingtung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); G06F 17/50 (2006.01); H01L 27/088 (2006.01); H03K 19/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); G06F 17/5036 (2013.01); G06F 17/5072 (2013.01); G06F 17/5077 (2013.01); H01L 23/5226 (2013.01); H01L 27/088 (2013.01); H03K 19/20 (2013.01);
Abstract

An integrated circuit includes a cell that is between a substrate and a supply conductive line and that includes a source region, a contact conductive line, a power conductive line, and a power via. The contact conductive line extends from the source region. The power conductive line is coupled to the contact conductive line. The power via interconnects the supply conductive line and the power conductive line.


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