The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2018

Filed:

Jul. 07, 2014
Applicants:

Honeywell International Inc., Morristown, NJ (US);

Ya Qun Liu, Morristown, NJ (US);

Liang Zeng, Morristown, NJ (US);

Hui Wang, Morristown, NJ (US);

Bright Zhang, Morristown, NJ (US);

Hong Min Huang, Morristown, NJ (US);

Inventors:

Ya Qun Liu, Pudong, CN;

Liang Zeng, Shanghai, CN;

Hui Wang, Shanghai, CN;

Bright Zhang, Shanghai, CN;

Hong Min Huang, Pudong, CN;

Assignee:

Honeywell International Inc., Morris Plains, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); C09K 5/14 (2006.01); H01L 23/42 (2006.01); C08K 13/02 (2006.01); C08L 23/08 (2006.01); C09K 5/06 (2006.01); C09K 15/06 (2006.01); C09K 15/22 (2006.01); C09K 15/24 (2006.01); C09K 15/30 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08K 13/02 (2013.01); C08L 23/0815 (2013.01); C09K 5/063 (2013.01); C09K 15/06 (2013.01); C09K 15/22 (2013.01); C09K 15/24 (2013.01); C09K 15/30 (2013.01); H01L 23/3675 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01); H01L 24/32 (2013.01); H05K 7/2039 (2013.01); C08K 2201/001 (2013.01); C08L 2201/08 (2013.01); C08L 2203/20 (2013.01); G06F 1/20 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29309 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29316 (2013.01); H01L 2224/29318 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/0503 (2013.01); H01L 2924/05032 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/0542 (2013.01); H01L 2924/0544 (2013.01); H01L 2924/05432 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1432 (2013.01);
Abstract

A thermal interface material includes at least one polymer, at least one thermally conductive filler; and at least one ion scavenger. In some embodiments, the ion scavenger is a complexing agent selected from the group consisting of: nitrogen containing complexing agents, phosphorus containing complexing agents, and hydroxyl carboxylic acid based complexing agents.


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