The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2018

Filed:

Jan. 29, 2018
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Masaya Seki, Tokyo, JP;

Tetsuji Togawa, Tokyo, JP;

Kenya Ito, Tokyo, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/00 (2012.01); B24B 21/00 (2006.01); B24B 21/02 (2006.01); B24B 27/00 (2006.01); B24B 49/12 (2006.01); B24B 9/06 (2006.01);
U.S. Cl.
CPC ...
B24B 21/002 (2013.01); B24B 9/065 (2013.01); B24B 21/00 (2013.01); B24B 21/004 (2013.01); B24B 21/02 (2013.01); B24B 27/0076 (2013.01); B24B 49/00 (2013.01); B24B 49/12 (2013.01);
Abstract

A polishing unit of a polishing apparatus according to an embodiment includes: a polishing head having a pressing member configured to hold a polishing tape and press the polishing tape against a peripheral portion of a substrate from above; a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and recover the polishing tape from the polishing head; a first moving mechanism configured to move the polishing head in a radial direction of the substrate; and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The positioning unit includes a positioning block having a contacting surface, and alignment of the polishing tape is conducted by the second moving mechanism moving the tape supply and recovery mechanism so that a substrate-side edge of the polishing tape makes contact with the contacting surface.


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