The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2018
Filed:
Sep. 27, 2017
Applicant:
Nxp Usa, Inc., Austin, TX (US);
Inventors:
Lakshminarayan Viswanathan, Phoenix, AZ (US);
Michael Watts, Scottsdale, AZ (US);
Assignee:
NXP USA, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 23/057 (2006.01);
U.S. Cl.
CPC ...
H01L 24/49 (2013.01); H01L 23/4985 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/37 (2013.01); H01L 24/50 (2013.01); H01L 24/73 (2013.01); H01L 24/86 (2013.01); H01L 23/057 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/37599 (2013.01); H01L 2224/40157 (2013.01); H01L 2224/45099 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48157 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/49176 (2013.01); H01L 2224/50 (2013.01); H01L 2224/73229 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/84801 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/161 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/30111 (2013.01);
Abstract
A packaged RF device is provided that utilizes flexible circuit leads. The RF device includes at least one integrated circuit (IC) die configured to implement the RF device. The IC die is contained inside a package. In accordance with the embodiments described herein, a flexible circuit is implemented as a lead. Specifically, the flexible circuit lead is coupled to the at least one IC die inside the package and extends to outside the package, the flexible circuit lead thus providing an electrical connection to the at least one IC die inside the package.