The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2018
Filed:
Dec. 15, 2017
Applicant:
Nxp Usa, Inc., Austin, TX (US);
Inventors:
Rama I. Hegde, Austin, TX (US);
Varughese Mathew, Austin, TX (US);
Assignee:
NXP USA, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 23/14 (2013.01); H01L 23/49513 (2013.01); H01L 23/49517 (2013.01); H01L 23/49541 (2013.01); H01L 23/49582 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05005 (2013.01); H01L 2224/05012 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48847 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01);
Abstract
A semiconductor device includes a leadframe having a flag and a plurality of bond terminals. A semiconductor die is attached to the leadframe at the flag. A bond pad is formed on the semiconductor die. A top surface layer of the bond pad includes copper having a predetermined grain orientation. A bond wire includes a first end and a second end. The bond wire is attached to the bond pad at the first end and attached to one of the bond terminals in the plurality at the second end.