The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2018
Filed:
May. 15, 2017
International Business Machines Corporation, Armonk, NY (US);
Charles E. Cox, San Jose, CA (US);
Harald Huels, Horb, DE;
Arvind Kumar, Chappaqua, NY (US);
Xiao Hu Liu, Briarcliff, NY (US);
Ahmet S. Ozcan, San Jose, CA (US);
Winfried W. Wilcke, Los Altos Hills, CA (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
A method is provided to supply power to wafer-scale ICs. The method includes receiving a wafer containing ICs placed on the top of the wafer. The wafer has through-hole vias to provide power from the bottom to the ICs. The method also includes a printed circuit board, which has power rails in a pattern on the top of the printed circuit board, where the rails provide voltage and ground. The method continues with placing metal solder spheres between the bottom of the wafer and the top of the printed circuit board, where the spheres provide connections between the two, and where the spheres are free to move and operate as mechanical springs to resist clamping forces. The method also includes applying clamping pressure to the structure to establish connections by compressing the spheres, where no soldering is required.