The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2018

Filed:

Sep. 25, 2014
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Chia-Hua Chu, Zhubei, TW;

Allen Timothy Chang, Hsin-chu, TW;

Ching-Ray Chen, Taipei, TW;

Yi-Hsien Chang, Shetou Township, TW;

Yi-Shao Liu, Zhubei, TW;

Chun-Ren Cheng, Hsin-Chu, TW;

Chun-Wen Cheng, Zhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 33/53 (2006.01); G01N 33/543 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
G01N 33/54386 (2013.01); H01L 21/00 (2013.01); H01L 2224/18 (2013.01);
Abstract

The present disclosure provides biochips and methods of fabricating biochips. The method includes combining three portions: a transparent substrate, a first substrate with microfluidic channels therein, and a second substrate. Through-holes for inlet and outlet are formed in the transparent substrate or the second substrate. Various non-organic landings with support medium for bio-materials to attach are formed on the first substrate and the second substrate before they are combined. In other embodiments, the microfluidic channel is formed of an adhesion layer between a transparent substrate and a second substrate with landings on the substrates.


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