The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2018

Filed:

Jan. 30, 2015
Applicant:

Fujimi Incorporated, Kiyosu-shi, Aichi, JP;

Inventors:

Shuugo Yokota, Kiyosu, JP;

Shota Suzuki, Kiyosu, JP;

Tomohiko Akatsuka, Kiyosu, JP;

Yasuyuki Yamato, Kiyosu, JP;

Koichi Sakabe, Kiyosu, JP;

Yoshihiro Izawa, Kiyosu, JP;

Yukinobu Yoshizaki, Kiyosu, JP;

Chiaki Saito, Kiyosu, JP;

Assignee:

FUJIMI INCORPORATED, Kiyosu-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); C11D 7/22 (2006.01); H01L 21/3105 (2006.01); H01L 21/321 (2006.01); H01L 21/02 (2006.01); C09K 3/14 (2006.01); C11D 7/26 (2006.01); C11D 7/28 (2006.01); C11D 7/32 (2006.01); C23G 5/028 (2006.01);
U.S. Cl.
CPC ...
C11D 7/22 (2013.01); C09K 3/1409 (2013.01); C11D 7/26 (2013.01); C11D 7/28 (2013.01); C11D 7/3209 (2013.01); C23G 5/028 (2013.01); H01L 21/02024 (2013.01); H01L 21/02041 (2013.01); H01L 21/31053 (2013.01); H01L 21/3212 (2013.01);
Abstract

The purpose of the present invention is to provide a means to sufficiently remove impurities remaining on the surface of a polishing object after CMP. The polishing composition of the present invention is a polishing composition which is used after polishing has been performed by using a polishing composition (A) including abrasive grains or an organic compound (A), and is characterized by including an organic compound (B) which includes at least one atom selected from the group consisting of a fluorine atom, an oxygen atom, a nitrogen atom, and a chlorine atom and has a molecular weight of 100 or more, a pH adjusting agent, and 0 to 1% by mass of abrasive grains.


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