The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2018
Filed:
Jun. 22, 2015
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0232 (2014.01); H01L 29/32 (2006.01); H01L 29/16 (2006.01); H01L 21/67 (2006.01); H01L 21/66 (2006.01); H01L 21/322 (2006.01); H01L 21/324 (2006.01); C30B 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/32 (2013.01); H01L 21/324 (2013.01); H01L 21/3225 (2013.01); H01L 21/67098 (2013.01); H01L 21/67288 (2013.01); H01L 22/12 (2013.01); H01L 29/16 (2013.01); C30B 29/06 (2013.01); H01L 2924/0002 (2013.01);
Abstract
Some embodiments relate to a silicon wafer having a disc-like silicon body. The wafer includes a central portion circumscribed by a circumferential edge region. A plurality of sampling locations, which are arranged in the circumferential edge region, have a plurality of wafer property values, respectively, which correspond to a wafer property. The plurality of wafer property values differ from one another according to a pre-determined statistical edge region profile.