The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Dec. 23, 2014
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Arun Virupaksha Gowda, Rexford, NY (US);

Paul Alan McConnelee, Albany, NY (US);

Risto Ilkka Tuominen, Yokohama, JP;

Assignee:

GENERAL ELECTRIC COMPANY, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 23/4985 (2013.01); H01L 24/19 (2013.01); H01L 22/12 (2013.01); H01L 22/14 (2013.01); H01L 23/49838 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83127 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/37001 (2013.01);
Abstract

An electronic package is provided. The electronic package includes a substrate and a plurality of vias defined by a corresponding plurality of pre-defined via patterns. The electronic package further a metal built-up layer disposed on portions of the substrate to provide a plurality of pre-defined via locations and the plurality of pre-defined via patterns of the plurality of vias. Also, the electronic package includes a first conductive layer disposed on at least a portion of the metal built-up layer. Moreover, the electronic package includes a second conductive layer disposed on the first conductive layer, where the plurality of vias is disposed at least in part in the metal built-up layer, the first conductive layer, and the second conductive layer.


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