The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Nov. 30, 2017
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Paul Alan McConnelee, Albany, NY (US);

Arun Virupaksha Gowda, Rexford, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/74 (2006.01); H01L 31/111 (2006.01); H01L 23/053 (2006.01); H01L 23/12 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 25/16 (2006.01); H01L 25/00 (2006.01); H01L 23/14 (2006.01); H01L 23/31 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/561 (2013.01); H01L 21/486 (2013.01); H01L 21/76802 (2013.01); H01L 21/76897 (2013.01); H01L 23/147 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 23/49827 (2013.01); H01L 23/528 (2013.01); H01L 23/5221 (2013.01); H01L 23/5226 (2013.01); H01L 23/538 (2013.01); H01L 23/5389 (2013.01); H01L 23/53228 (2013.01); H01L 24/03 (2013.01); H01L 24/09 (2013.01); H01L 24/19 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 23/49816 (2013.01); H01L 24/29 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/105 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24195 (2013.01); H01L 2224/291 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83865 (2013.01); H01L 2224/83874 (2013.01); H01L 2224/83895 (2013.01); H01L 2224/83931 (2013.01); H01L 2224/92144 (2013.01); H01L 2224/97 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/20 (2013.01);
Abstract

An electronics package includes a lower insulating layer, an upper insulating layer coupled to the lower insulating layer, and a conductive contact pad coupled to a second surface of the upper insulating layer. An electrical component is positioned within an opening formed through the upper insulating layer. A first interconnect layer extends through at least one via in the lower insulating layer to electrically couple with at least one contact pad on the electrical component and a second interconnect layer extends through at least one via in the upper insulating layer and electrically couples the first interconnect layer to the conductive contact pad.


Find Patent Forward Citations

Loading…