The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Sep. 28, 2016
Applicant:

Fujimi Incorporated, Kiyosu-shi, Aichi, JP;

Inventors:

Yukinobu Yoshizaki, Aichi, JP;

Shogo Onishi, Kiyosu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); H01L 21/3212 (2013.01);
Abstract

The purpose of the present invention is to provide a polishing composition which can polish an object to be polished containing oxygen atoms and silicon atoms at high polishing speed, and can reduce generation of scratches on a surface of the object to be polished. A polishing composition used for polishing an object to be polished containing oxygen atoms and silicon atoms, the polishing composition including: abrasive grains A having an average primary particle size of 3 nm or more and 8 nm or less; abrasive grains B having an average primary particle size of more than 8 nm; and a dispersing medium, wherein a content of the abrasive grains B in the polishing composition is larger than a content of the abrasive grains A in the polishing composition, average silanol group density of the abrasive grains A and the abrasive grains B is 2.0 nmor less, and an aspect ratio of the abrasive grains B is more than 1.3 and 2.0 or less.


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