The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Apr. 12, 2017
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Kazuaki Maeda, Tokyo, JP;

Tamami Takahashi, Tokyo, JP;

Masaya Seki, Tokyo, JP;

Hiroaki Kusa, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 21/00 (2006.01); B24B 41/06 (2012.01); B24B 21/06 (2006.01); B24B 21/08 (2006.01); B24B 37/04 (2012.01); B24B 9/06 (2006.01);
U.S. Cl.
CPC ...
B24B 21/002 (2013.01); B24B 9/065 (2013.01); B24B 21/004 (2013.01); B24B 21/06 (2013.01); B24B 21/08 (2013.01); B24B 37/04 (2013.01); B24B 41/06 (2013.01);
Abstract

A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.


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